current vacancies

Linkam is a world leader in the design, development and manufacture of sample characterisation solutions based around our thermal stages. We are based in the UK but our customers are in all corners of the world and our products can be found in laboratories in most of the top companies and Universities. Would you like to part of a dynamic, market leading business?

Due to Linkam’s ongoing success and expansion we have a number of opportunities across all areas of the business.

Below you will see a short summary of each vacancy. For a full description please download the PDF. If you would like to apply for one of the positions please send a covering letter together with your CV to the Finance & Operations Director,

R&D - Mechanical Design Engineer

The position is for a mechanical engineer to work in the design office.
The main responsibilities include:  

  • Working as part of a team of designers to develop new features for existing products
  • Collaboration on design of completely new prototypes
  • To support the production of our existing instruments by maintaining part drawings and product bills of materials.
  • To help with new product testing and aid the writing of product literature.

R&D - Software Developer

 Linkam is expanding into new fields with many exciting and challenging products.
Our R&D team in the UK has members with a skill sets covering optical, mechanical, electronic, and software engineering.
Linkam manufacture a range of thermal microscopy stages, relating imaging and physical sensor measurements, and are looking to expand the team with a view to broadening our software base and to introduce new technologies and architectures so we can expand our imaging products looking at a range of cameras and open source libraries.

R&D - Electronics Engineer

You will be working within the R&D team with a view to supporting our range of microscope based instruments which are based around ST STM32 Arm microcontrollers.

A knowledge of small signal  processing is essential, as we use a range of low output sensors in the design of new prototype instruments, most of which have embedded microcontrollers. Software is written in ‘C’ and debugging is from the IAR ARM workbench.

PCB design is also part of the role where we use PADS PCB and Logic for all our surface mount layouts. Boards are then assembled by a 3rd party, although experience of surface mount rework is required.

With each new design there will be a requirement to consider EMC and LVD and to gather documentation to support the submission to an external test house.

This role is varied but has the freedom for an individual to see the design from inception through to production with a high degree of individual input.